On the Christmas morning, MediaTek held a Product Communication Conference event in Beijing, China where the popular Taiwanese semiconductor company has announced their next generation chipsets for the middle-ranged devices that will support 5G connectivity in the future, with their all new Dimensity 800 SoC.
The new processor will bring along an integrated Helio M70 5G capable modem to support the fastest network speeds upto 4.7Gbps down and 2.5Gbps uplink. You will also find a Mali-G77 MP9 Graphics Processing Unit on board. We heard that, the company is expecting to see smartphones come equipped with their all new MediaTek Dimensity 800 processor starting the second quarter of next year and will get an official listing from the manufacturer in the first quarter of 2020.
Unfortunately MediaTek haven't disclosed any specifications on the chipset's architecture, clockspeed or any other detailed information but promised us that more mid-ranged handsets will start supporting the blazing speeds of dual-mode 5G SA/NSA (standalone and non-standalone networks) frequency bands. Towards the end of November, the company also announced their Dimensity 1000 SoC, built on the 7nm process based architecture, which is the first mainframe from the Taiwanese to ship with integrated 5G modem working on 4x ARM Cortex-A77 cores running at 2.6GHz and 4x Cortex-A55 power-efficient cores clocked at 2GHz. We already saw Oppo announce the all new Reno 3 smartphone that ships with the Dimensity 1000 under the hood, which is MediaTek's approach to more higher-end smartphones. The new processor may give a direct competition to Huawei's in-house Kirin 800 series of processors as well as to Qualcomm's Snapdragon 7 series chipsets.
Source: IT, GSMArena